TY - JOUR
TI - The adoption of novel cooling liquids for enhancing heat transfer performance of 3-D integrated circuits with embedded micro-channel
AU - Huang Huan
AU - Shan Chun
AU - Long Futang
AU - Zeng Zongjie
AU - Xie Lei
AU - Zou Fa
AU - Xu Peng
JN - Thermal Science
PY - 2025
VL - 29
IS - 1
SP - 227
EP - 250
PT - Article
AB - The nanofluids (including MWCNT based nanofluid and SWCNT based nanofluid) and liquid metal Ga68In20Sn12 are proposed to replace the conventional water as cooling liquid of micro-channel for enhancing heat transfer performance of 3-D integrated circuits (3-D IC) in this paper. An equivalent thermal model of 3-D IC with integrated micro-channel is established to investigate the heat transfer performances for using different cooling liquids. The results show that the steady-state temperature for MWCNT based nanofluid, SWCNT based nanofluid and Ga68In20Sn12 as cooling liquids can be reduced over 25.698%, 28.771%, and 35.735% than the conventional water scheme in a four-layers stacked chip, respectively. Besides, it is found that the steady-state temperature of all die layer in 3-D IC can be further reduced by increasing the micro-channel size and flow velocity of cooling liquid. Therefore, the proposed novel materials (i.e., nanofluids and Ga68In20Sn12) as cooling liquids have excellent application prospect in solving thermal problems of 3-D IC.